Chinese scientists develop ultra thin flexible semiconductor chip

BEIJING: Semiconductor chips, the heart of modern electronic devices, are typically rigid and limited in size. However, Chinese scientists have achieved a breakthrough that could revolutionize chip technology.

Researchers at Fujian University have developed a flexible fiber semiconductor chip as thin as a human hair, yet strong enough to withstand immense pressure. Unlike traditional silicon chips, this innovative chip can be bent thousands of times without damage, and can even support the weight of heavy trucks without compromising its structure.

The team designed the chip using a novel approach inspired by sushi rolls. A conventional chip was embedded within a smooth polymer sheet and coated with a protective polymer layer, making it highly flexible and durable. The resulting fiber chip can bend 180 degrees, is washable, and functions at temperatures up to 100 degrees Celsius.

This breakthrough opens new possibilities for wearable devices, medical implants, and other flexible electronics. While currently a conceptual prototype, researchers hope to develop it for commercial applications in the future.